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PVDF silicon chips carrier
Specification: 162*162*110 (compatible with 156-162 silicon wafers)

1. The high-strength carbon fiber rod is wrapped inside, which will not cause metal pollution.
2 the production process is high-temperature annealing treatment, not easy to crack.
3. It adopts one-piece injection molding and has a firm structure.
4. The end plates on both sides can be distinguished by color to facilitate visual management.

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